华邦电子印制电路板技术指标 |
单面/双面single/double sided p.c.b |
最大面积max board size | | 400*900mm |
板厚board thickess | | 0.4mm - 3.0mm |
铜厚copper thickess | | 18um、36um、72um |
基材base material | | fr-4、cem-1、cem-3、铝基板 |
最小线宽the min track | | 0.2mm(1±15%) |
最小间隙the min clearence | | 0.2mm(1±15%) |
最小孔径the min cliameter | | 0.3mm±0.1mm |
孔壁厚度hole plating thickness | | ≥18um |
金属化孔孔径公差pth hole tolerance | >∮0.8 | ±0.10mm |
≤∮0.8 | ±0.05mm |
孔位公差hole position deviation | | ±0.080mm |
外型尺寸公差outline tolerance | | ±0.20mm |
绝缘电阻insulation resistance | | ≥10^12欧姆（常态） |
孔电阻through hole resisance | | ≤300欧姆 |
抗电强度dielectric strcemgth | | ≥1.6kv/mm |
耐电流current breakdown | | 10a |
抗剥强度peet-off strength | | 1.5n/mm |
阻焊剂硬度solder mask abrasion | | >5h |
热冲击thermal strenss | | 288 c+5 c,10ses |
自熄性inflannabikity | | 94v-0 |
通断测试电压e-test voltage | | 10-250v |
焊盘拉脱强度pull of strength of peels | | >100n |
可焊性sloder ability | | 235℃+55℃在3s内湿润 |
翘曲度bow and twist | | ≤0.75% |