cog设备，ic邦定机,ic贴片,cog

cog,cog设备，cog邦定，cog维修

设备应用途：

本产品适用于各种液晶（lcd glass)与驱动IC对位（预压）邦定。

application:

the machine is used for aligning and bonding ic driver to various lcd glasses.

工艺应用: snt cstn tft

technic application: snt cstn tft

◆功能特点：

key feature:

■sunsom 压力系统双缸除压头自重，压力最小精度可达0.1kg

double cylinders of sunsom pressure system eliminate self-gravity of bond head. minimum pressure is 0.1kg.

■自主研发残余图像与plc程序相结合，操作简单直观。

combination of self-developed ic image and plc program make the operation simply and intuitively.

■真空系统采用外置真空，耗气量低，适用于各种小批量作业。

external vacuum pump, low consumption, applied to small production.

■独特翻转式结构，适用于各种尺寸ic邦定。

unique reversal structure suitable to various ic bonding. 

■配备日本smc精密压力部件、控制系统、人机界面。

japanese smc precise pressure components,controlling system and human-machine interface.