1. rating額定值: | dc 12v0.5a |
2. operationtemperaturerange使用溫度範圍： | -30~+70℃ |
3.preservativetemperaturerange：保存溫度範圍： | -40~+85℃ |
4. construction dimension結構尺寸： | apply to the appended drawing： 符合附加圖紙 |
item项目 | test condition測試條件 | specification規格 |
5. electronical characteristics.電氣性能. |
5a | contact resistance 接觸阻抗 | being measured at 1khz small current contact resistance meter. 在1khz小電流下測量. | 30mω max 30毫歐以下. |
5b | insulation resistance 絕緣阻抗 | measurements shall be made following application of dc100v potential across terminals and across terminals and frame for 1 minute. 在端子之間和端子與殼之間加dc100v條件下,持續1分鐘測量. | 100mω min 100兆歐以上. |
5c | withstand voltage 耐電壓 | ac 500v (50hz or 60hz) shall be applied across terminals and across terminals and frame for one minute 在端子之間和端子與殼之間加ac 500v(50hz或60hz)條件下,持續1分鐘測量. | there shall be no breakdown. 無擊穿現象出現. |
6. mechanical characteristics.機械性能. |
6a | actionpower 动作力 | | action power 100±350gf 动作力 100±350gf |
6b | terminal strength 端子強度 | a static force of 500gf being applied in one direction on the tip of terminal for 1 minute. 一個500克之靜負荷施加於端子頂部的一個方向持續1分鐘。 | there shall be no sign of damage mechanically and electrically. 無任何迹象顯示機械及電氣性能之損壞. |
7. durability.耐久性. |
7a | soldering test. 可焊性試驗 | the tip of the terminals shall be dipped 2mm in the solder bath at a temperature of 230±5℃for2±0.5sec.端子頂部被浸入焊錫池2mm深,溫度230±5℃時間2±0.5秒。 | a new uniform coating of solder shall cover a minimum of90of the surface being immersed.浸入的部分90%以上表面將被錫覆蓋. |
7b | resistance to soldering heat 耐焊接熱 | soldering area:t/2 of p.c.b thickness焊接面積：印刷基板的1/2厚度處 temperature:260±5℃sinkingtime: 5±1s.焊接溫度：260±5℃，焊接時間：5±1秒。 | no damage (electrical and mechanical) 無異常。（電氣、機械特性） |