电子元器件或其它的小型部件粘接的贴片红胶
| 品牌 |
胜泰 |
树脂胶分类 |
环氧树脂 |
| 型号 |
t-5829 |
粘合材料 |
电子元件 |
t-5829 technical data sheet
one component epoxy surface mount adhesive
单组分环氧树脂贴片胶
product description产品介绍
t-5829 surface mount adhesive is formulated to bond electrical devices or other small parts to printed circuit boards before wave soldering by pin transfer method. it has following features.t-5829 贴片胶用于在针转移法的波峰焊之前将电子元器件或其它的小型部件粘接在印刷电路板上.它具有以下特性.
l low moisture absorption潮气吸收率低
l excellent green/wet strength极佳的未固化/湿强度
l high dot profile and resists slumping and stringing极好的点状外观，抗流淌和拉丝
l broad equipment capability with high-volume screen printing满足大体积丝网印刷的设备通用性
properties of uncured material固化前材料性能
property 性能 | test method 测试方法 | t-5829 |
color/appearance颜色/外观 | visual | viscous red gel粘稠红色凝胶 |
specific gravity密度, g/cc, | astm d-792 | 1.21 |
viscosity粘度, (cp), 25℃ | astm d-2393 | ~20,000 |
yield strength屈服强度,cone & plate, pa, 25°c | | 200-300 |
typical properties of cured material固化后材料典型物理性能
property性能 | test method测试方法 | value数值 |
coefficient of thermal expansion热膨胀系数, cte | astm d696 | 140 e-06 |
thermal conductivity热导率, w/m-k | astm c177 | 0.4 |
lap shear strength搭接剪切强度, steel钢, mpa | | 28 |
torque strength扭转强度, fr4 pcb, n.mm | | 50 - 80 |
volume resistivity体电阻系数, ohms-cm | astm d-257 | 2.1 e+15 |
surface resistivity表面电阻系数, ohms | astm d-257 | 2.0 e+15 |
dielectric constant电介质常数 | astm d150 | 3.7(1 khz), 3.6(10 khz) |
torque retention 30 seconds @100°c+3 seconds @260°cflux and wave solder波峰焊中30秒@100°c+3秒@260°c的扭力保持 | | 100 % |
hot solder dip @260°c热浸焊@260°c | | pass通过 |
directions for use使用方法
typical curing condition典型固化条件: 3 min. at 150 ºc在150 ºc下保持3分钟
curing starts above 100 ºc, with a dsc conversion of 90%, 5 min. at 125 ºc.固化开始于100 ºc以上,在125 ºc保温5分钟,热转换为90%.
cleaning清除
uncured adhesive can be easily removed from printed circuit boards using isopropyl alcohol(ipa) or mek.未固化胶粘剂可被轻易从印刷电路板上用异丙醇或丁酮清除
storageinformation保存方法
在5 ºc下密封干燥储存,保质期为6个月